Module 3: Floorplanning · 3.3 I/O Pin Placement

Pad-Limited Versus Core-Limited Designs

Section 3.1 computed a 50 by 50 µm die for counter8, driven entirely by core area, utilisation and margin. That assumed the core was what set the die’s size. Time to check the assumption, because for a design this small it is probably wrong.

Two different bottlenecks

Every die has to satisfy two independent constraints at once: big enough to hold the core (cells plus routing), and enough perimeter to fit every I/O pad the design needs, at whatever pitch (centre-to-centre spacing) the pad cells require. Whichever demands the bigger die wins; the other rides along with room to spare.

  • Core-limited: the die is exactly what Section 3.1’s arithmetic said, enough for the core plus margin, and the pads fit comfortably in that perimeter. The common case for large, logic-dense chips with modest pin counts.
  • Pad-limited: the core would fit in a much smaller die, but there is not enough perimeter at that size to fit every pad at its minimum pitch, so the die grows purely to make room for I/O.

Pad-limited designs are far more common than newcomers expect, for the reason counter8 is about to show: small designs have small cores, but pad count does not shrink nearly as fast, because every design needs a baseline of power, ground and signal pads regardless of how little logic it has.

Checking counter8 against both

Section 3.1 gave the core-limited answer: a 50 by 50 µm die, perimeter $4 \times 50 = 200$ µm.

Now the pad-limited side. counter8 needs 11 signal pads and, like any real design, a few dedicated power and ground pads independent of signal count. Say 4 (two VDD, two VGND, for redundancy), for 15 pads total. Assume an illustrative pad pitch of 40 µm, a representative order of magnitude for small pad-limited test chips rather than a PDK-quoted number. The minimum perimeter for 15 pads at that pitch:

$$P_{\min} = \text{pad count} \times \text{pad pitch} = 15 \times 40 = 600 \text{ µm}$$

Constraint Required perimeter
Core-limited (from 3.1) 200 µm
Pad-limited (this article) 600 µm

600 µm is three times 200. counter8’s die size is not set by its core; it is set by its pads, by a wide margin. A square die with a 600 µm perimeter has a 150 µm side, nine times the area of the 50 by 50 core-limited estimate, purely to fit the pad ring.

The 50 by 50 core-limited die where 15 pads cannot fit, next to the 150 by 150 pad-limited die where they do
Figure 1: The same core, sized by logic and sized by pads

This is why tiny educational and shuttle designs so often look wasteful in photos, with huge margins of empty silicon around a small block of logic. That is not waste; it is the pad ring doing its job. counter8 is a realistic pad-limited example, not a contrived one. Computing only the core-limited size and treating it as final, without checking pad count against pitch, produces a die spec that cannot be built. OpenLane’s I/O placement step fails outright when it cannot fit the required pads into the space you gave it.

Practice Exercise

A design has a core-limited die perimeter of 320 µm. It needs 25 pads (signal plus power and ground) at a 35 µm pitch. Is it pad-limited or core-limited, and what perimeter should be used?

Solution

Pad-limited perimeter = 25 × 35 = 875 µm, far larger than the 320 µm core-limited figure, so the design is pad-limited. The die must have at least 875 µm of perimeter (about 219 µm per side if square). Using the smaller core-limited figure would give a die that cannot fit all 25 pads.

Knowing which side a pin goes on and how big the die really needs to be sets up the last piece of I/O placement: in the next article we write an actual pin order file and hand it to OpenLane.

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